TSM wave 3 progressing.
Taiwan Semiconductor Manufacturing or TSMC
2330
opened Advanced Backend Fab 6, a packaging and testing fabrication plant located in Zhunan Science Park, Miaoli, northern Taiwan, according to a Thursday press release.
The facility, which commenced construction in 2020, was built to mass-produce the company's SoIC (System on Integrated Chips) process technology.
The fab has a base area of 14.3 hectares, making it TSMC's largest advanced backend fab to date, the chipmaker said.
It is estimated to have an annual production capacity of over 1 million 12-inch wafer equivalent 3DFabric process technology and more than 10 million hours of testing services.
2330
opened Advanced Backend Fab 6, a packaging and testing fabrication plant located in Zhunan Science Park, Miaoli, northern Taiwan, according to a Thursday press release.
The facility, which commenced construction in 2020, was built to mass-produce the company's SoIC (System on Integrated Chips) process technology.
The fab has a base area of 14.3 hectares, making it TSMC's largest advanced backend fab to date, the chipmaker said.
It is estimated to have an annual production capacity of over 1 million 12-inch wafer equivalent 3DFabric process technology and more than 10 million hours of testing services.